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Quartz Boat

product details

Name:

6-inch Quartz Bent Plate Boat

Function & Application:

The quartz boat is a carrier used to transport and process semiconductor wafers. Wafers are placed onto the quartz boat and then loaded into the furnace tube for batch processing. It is applied in diffusion, oxidation, and CVD deposition processes in wafer manufacturing, which are high-temperature processes.

Performance Requirements:

High temperature resistance, corrosion resistance, excellent thermal stability, high optical transparency, and low impurity content.

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  • +86-572-3032373

    +86-572-3033016

More About Products

Quartz Bent Plate Boats for Diffusion Furnaces are high-purity wafer carriers designed to ensure stable, clean, and efficient handling of silicon wafers during high-temperature semiconductor processes such as diffusion, oxidation, and CVD deposition. Manufactured from ultra-pure fused quartz, these boats offer outstanding thermal stability, minimal thermal expansion, and strong resistance to corrosion and thermal shock—making them ideal for use in diffusion furnace environments.

The bent plate structure provides secure wafer support, promotes uniform gas flow, and enhances temperature distribution across the wafer surfaces. With precisely machined dimensions and smooth surfaces, the boats help reduce particle generation and wafer edge damage while maintaining consistent spacing and alignment. Their high optical transparency and low impurity content meet the rigorous demands of advanced wafer fabrication lines and R&D applications, ensuring clean, repeatable processing cycles.

What is Diffusion Furnaces in Semiconductor Process?

Diffusion Furnace in semiconductor manufacturing is a specialized high-temperature processing chamber used to introduce dopant atoms into silicon wafers. This process, called diffusion, modifies the electrical properties of the silicon by adding impurities such as phosphorus, boron, or arsenic, which are critical for creating semiconductor devices like transistors and integrated circuits.

Features of Diffusion Furnaces

  • High Temperature: Operates typically between 800°C and 1200°C to enable dopant atoms to diffuse into the silicon lattice.
  • Controlled Atmosphere: Uses controlled gases—such as nitrogen, oxygen, or dopant-containing gases—to create the desired chemical environment.
  • Batch Processing: Can process multiple wafers simultaneously, placed inside quartz boats or carriers, ensuring uniform exposure.
  • Precise Control: Temperature, gas flow, and timing are tightly regulated for accurate dopant concentration and depth profiles.

Why Diffusion Furnaces Are Important

  • They create well-defined doped regions in wafers necessary for forming electronic components.
  • The diffusion process determines device performance, including speed, power consumption, and reliability.
  • They are a foundational step before further processing like oxidation, etching, and metallization.

Diffusion furnaces are essential semiconductor tools that enable precise doping of silicon wafers, shaping the electrical characteristics of semiconductor devices.

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